好讀網址:http://www.xfastest.com/thread-134439-1-1.html 前言: AMD推出R9系列後，許多廠商紛紛推出R9 270系列產品，R9 270簡單說就是R9 270X降頻版 ，核心部分無閹割為Pitcaim核心，擁有1280個串流處理器，功耗比R9 270X低30W為150W 這次介紹的PowerColor TurboDuo R9 270 2GB OC，在散熱上下了不少功夫，採用 TurboDuo散熱技術，具備兩顆8公分大風扇，展現優於公版之19%散熱效能提升及8%運行噪 音降低之表現 用料方面採用高規格黃金用料，其中包含多相供電設計、高品質亞鐵鹽芯電感和 PowerPAK SO-8封裝MOSFET，可大幅提升整體超頻效能及穩定性，核心時脈為930 MHz，透 過Boost可達955 MHz，並搭配2GB GDDR5記憶體與1400MHz記憶體時脈 強化散熱與用料還有原廠Boost後的R9 270有怎樣的表現就讓我們繼續看下去嚕^^ http://www.xfastest.com/images/xftitle.png外包裝與外觀.配件 ▼外包裝同樣採用透明簍空設計，背面系統環境要求與產品特色：2GB GDDR5記憶體、 DirectX 11.2的支援以及最多可同時輸出四個顯示器的AMD Eyefinity技術、可4K*2K顯示 、與採用PCIE3.0介面等，強調TurboDuo散熱設計可降低8%的噪音與提升19%的散熱能力， 用料部分採用高規格黃金用料 http://www.xfastest.com/data/attachment/album/201405/05/103459bgeta92an95npuxt.jpg http://www.xfastest.com/data/attachment/album/201405/05/103501i4dxvfrrlel9gslp.jpg ▼TurboDuo字樣很有立體感，採用透明塑膠突字與平面文字勾出立體感 http://www.xfastest.com/data/attachment/album/201405/05/103502dyx4xawza1a5x491.jpg ▼顯示卡本體與配件:安裝手冊、驅動光碟、DVI轉接頭 http://www.xfastest.com/data/attachment/album/201405/05/103503tsrrd5pgjj9idgfd.jpg ▼顯示卡一覽，正面導風罩採用塑膠製品，導風罩採用紅黑配色，黑色為主體，紅色勾出 線條，散熱部分具備兩顆8公分大風扇並搭配3隻6mm C型熱導管設計及大面積鋁製鰭片， 讓散熱有著不錯的表現，顯卡本體占用2個Slot http://www.xfastest.com/data/attachment/album/201405/05/103503qyt8x8fooxyyrfxy.jpg http://www.xfastest.com/data/attachment/album/201405/05/103504q7ib41inc41cyi4w.jpg ▼輸出部分有Display Port、HDMI、DVI-I，支援AMD Eyefinity，如需使用D-SUB則可以 用轉頭將DVI-I轉成D-SUB使用 http://www.xfastest.com/data/attachment/album/201405/05/103507jmgbrot11zzl2hjr.jpg http://www.xfastest.com/images/xftitle.png細部用料 ▼背面有4顆螺絲拆開後，正反面一覽，晶片四周貼有膠墊，可避免散熱器壓壞GPU本體 http://www.xfastest.com/data/attachment/album/201405/05/103509lmudszadv0xcl0co.jpg http://www.xfastest.com/data/attachment/album/201405/05/104732ipy64u45h61yssip.jpg ▼前半部用料一覽，在DVI-I Connector上可看到金屬殼做雜訊遮蔽，上方有CrossFire 金手指，電源用料採用4相供電，搭配ON-Semi NCP5395T PWM控制器與高品質亞鐵鹽芯電 感，MOSFET採用PowerPAK SO-8封裝，結構為上1下2設計 http://www.xfastest.com/data/attachment/album/201405/05/103512bvv6vfwwfzr7wtm6.jpg http://www.xfastest.com/data/attachment/album/201405/05/103516fz7wk7kdgzgsg5rk.jpg ▼晶片周邊配置一覽 http://www.xfastest.com/data/attachment/album/201405/05/103513u34tvsastvk33vv7.jpg ▼後半部用料一覽，需要外接6pin電源，記憶體供電採用單相供電設計 http://www.xfastest.com/data/attachment/album/201405/05/103514mdf4pdq4slp4eml4.jpg ▼晶片後方背面放滿了電容，提升GPU供電穩定度 http://www.xfastest.com/data/attachment/album/201405/05/103518le1mci2t0t189c0y.jpg ▼記憶體部分採用SK Hynix H5GQ2H24AFR-R0C (運作時脈1400Mhz等效5.6G)GDDR5 8顆組 成2G容量 http://www.xfastest.com/data/attachment/album/201405/05/103519dzn7wu99u6jbwnp9.jpg ▼R9 270 核心晶片驗明正身 http://www.xfastest.com/data/attachment/album/201405/05/103520crvi0a0ehz6p0l67.jpg http://www.xfastest.com/images/xftitle.png散熱模組 ▼散熱模組一覽，散熱模組分為兩部分，散熱鰭片與導風罩，雙8公分風扇安裝於導風罩 上，風扇採用PISTEK製品GA81O2U http://www.xfastest.com/data/attachment/album/201405/05/103522rvv0tb44dfvv084b.jpg ▼整體散熱部分為三支6mm C型熱導管，從圖中可看到左右兩端末端處皆為貫穿散熱鰭片 式設計 http://www.xfastest.com/data/attachment/album/201405/05/103526xlqxn8jjp094j849.jpg http://www.xfastest.com/data/attachment/album/201405/05/103531sd1l9ee9y122a2l2.jpg http://www.xfastest.com/data/attachment/album/201405/05/103531wjo3j1v5zj58np1n.jpg http://www.xfastest.com/data/attachment/album/201405/05/103532aq7avqaqgyc5z7ve.jpg http://www.xfastest.com/images/xftitle.png[b][size=5]測試平台與環境 [/size][/b] 測試平台 CPU:Intel i5-4670K @ 4.5GHz Cooler: XIGMATEK GaiaII MB: ASRock B85 Pro4 RAM: A-DATA XPG DDR3-2400 16G kit(8G*2) VGA: PowerColor TurboDuo R9 270 2GB OC Storage: SanDisk U100 128G PSU: Steventeam 750W OS: Windows 7 旗艦版 64 Bit ▼3DMark06:33723 http://www.xfastest.com/data/attachment/album/201405/05/103708au81xdzcvsguttxs.jpg ▼3DMark Vantage Performance Mode:P27475 http://www.xfastest.com/data/attachment/album/201405/05/103732aa89fziohis9cbga.jpg ▼3DMark Vantage Extreme Mode:X13654 http://www.xfastest.com/data/attachment/album/201405/05/103731kn6ububznhn8hrsw.jpg ▼3DMark 11 Performance Mode:P7800 http://www.xfastest.com/data/attachment/album/201405/05/103713mzdu5mikfijfr0uj.jpg ▼3DMark 11 Extreme Mode:X2296 http://www.xfastest.com/data/attachment/album/201405/05/103709fgz3trhguvxmh25v.jpg ▼3DMark 2013 http://www.xfastest.com/data/attachment/album/201405/05/103726dod27vvoh0gffig7.jpg ▼3DMark 2013 Ice Storm Extreme:139839 http://www.xfastest.com/data/attachment/album/201405/05/103730ji88owtznu284gqu.jpg ▼3DMark 2013 Fire Strike Extreme:2573 http://www.xfastest.com/data/attachment/album/201405/05/103728m969ah4hwmmcwwnj.jpg ▼CINEBENCH R11 X64:64.39 fps http://www.xfastest.com/data/attachment/album/201405/05/103755onkef4e63j2f6obp.jpg ▼CINEBENCH R15 X64:134.63 fps http://www.xfastest.com/data/attachment/album/201405/05/103757i97gbqy6f9gbtmz2.jpg ▼BIO5 1920x1080 DirectX 10 ARGB8 TestA:147.7 fps http://www.xfastest.com/data/attachment/album/201405/05/103736h3sa47yez4safyus.jpg ▼BIO5 1920x1080 DirectX 10 ARGB8 TestB:158.9 fps http://www.xfastest.com/data/attachment/album/201405/05/103746sukxryts14xs9uuk.jpg ▼BIO6 1920x1080 DirectX 9.0C ARGB8:7428 http://www.xfastest.com/data/attachment/album/201405/05/103754a2ianhn2hodd4krd.jpg ▼DMC4 1920x1080 DirectX 10 A2RGB10 http://www.xfastest.com/data/attachment/album/201405/05/103803dvekgvbeeaaweywb.jpg ▼FF IXV 1920x1080:5242 http://www.xfastest.com/data/attachment/album/201405/05/103810bpph1uuuonuu7nnr.jpg ▼FF IXV(ONLINE)1920x1080:6423 http://www.xfastest.com/data/attachment/album/201405/05/103814fgvygiw6vmvgzcvg.jpg ▼Heaven 1920x1080 8xAA http://www.xfastest.com/data/attachment/album/201405/05/103818jvv33zzvyynp3wu3.jpg ▼LP2 1920x1080 DirectX 11 MSAA8X TestA:53.5 fps http://www.xfastest.com/data/attachment/album/201405/05/103819f5peesp5p5pyy681.jpg ▼LP2 1920x1080 DirectX 11 MSAA8X TestB:51.3 fps http://www.xfastest.com/data/attachment/album/201405/05/103820x0i5jajadfw5ccuj.jpg ▼SF IV 1920x1080 C16XQAA:11930 http://www.xfastest.com/data/attachment/album/201405/05/103822bybmmibbsmbxocqb.jpg ▼TLR 1920x1080:139.72 fps http://www.xfastest.com/data/attachment/album/201405/05/103824cvwchyyyk1hg3czm.jpg ▼FunMark燒機:最大溫度69度 風扇轉數45% 平均29fps http://www.xfastest.com/data/attachment/album/201405/05/103815gttt93t226d97dzr.jpg http://www.xfastest.com/images/xftitle.png[b][size=5]BF4遊戲畫面順暢度測試 [/size][/b] ▼BF4顯示設定 http://www.xfastest.com/data/attachment/album/201405/05/211331fnub8n858lohaiuc.jpg ▼BF4畫面 http://www.xfastest.com/data/attachment/album/201405/05/211332b8a6xaxq2xz86y8p.jpg http://www.xfastest.com/data/attachment/album/201405/05/211332kdyfhs71t1nt84f2.jpg http://www.xfastest.com/data/attachment/album/201405/05/211333tlif07fzqoynsopq.jpg 遊戲中順暢度相當不錯，fps都可以達到55張以上左右的表現，不會有lag的情形發生，某 些較為簡單的場景可達到70張左右的水準 http://www.xfastest.com/images/xftitle.png[b][size=5] Thief遊戲畫面順暢度測試 [/size][/b] ▼Thief顯示設定 http://www.xfastest.com/data/attachment/album/201405/11/165301glb9rbbmxx678acz.jpg ▼Thief畫面 http://www.xfastest.com/data/attachment/album/201405/11/165302zag264kx6rg6x26x.jpg http://www.xfastest.com/data/attachment/album/201405/11/165303iy6wctox0b64ct2y.jpg http://www.xfastest.com/data/attachment/album/201405/11/165304kbwfnfuzb8p622ug.jpg 遊戲中順暢度相當不錯，fps都可以一直維持在60張左右的表現，這款是目前2014年的遊 戲，畫面來說細節還不差，跑起來真的很順暢，沒有半點延遲現象產生 http://www.xfastest.com/images/xftitle.png[b][size=5]總結[/size][/b] 這張撼訊PowerColor TurboDuo R9 270 2GB OC在用料上下了不少工夫，電源方面採用高 規格黃金用料，包含多相供電設計、高品質亞鐵鹽芯電感和PowerPAK SO-8封裝MOSFET， 可大幅提升整體超頻效能及穩定性 散熱方面採用兩顆8公分風扇並搭配大面積鋁製鰭片有效率地降低溫度，展現優於版之19% 散熱效能提升及8%運行噪音降低之表現，使用FurMark燒機最高溫僅69度 且風扇聲音相當 安靜，幾乎感覺不出來顯示卡在全速運轉!! 在測試過程中表現很不錯，效能達到一定的水準，且原廠預設含Boost功能，效能比公版 卡表現更佳，許多遊戲都可以維持不錯的效能水準，已可滿足一般消費者在大部分遊戲的 順暢度，在BF4與Thief實際測試流暢度中，表現還不錯，玩起來非常順暢，場景與畫面細 節表現也相當不錯，這部分可以給需要的玩家做參考 http://www.xfastest.com/data/attachment/album/201405/11/161107gdi04gv4xw090zx4.jpg 在價格方面PowerColor TurboDuo R9 270 2GB OC這張在系列的價格較為漂亮的一款產品 ，與其他廠牌價格相差有500~1000元左右的差價，且為短卡設計，非常適合安裝在HTPC主 機內，原廠出廠提供Boost功能，讓效能表現更加出色，縮短了與R9 270X的效能差距，當 然有興趣的玩家可以透過第三方軟體來做超頻，相信會有更佳的表現，但別忘了散熱方面 還是要注意；有這樣的效能與漂亮的價格大大提升了這款PowerColor TurboDuo R9 270 2GB OC的CP值 整體來說中階卡定位的撼訊PowerColor TurboDuo R9 270 2GB OC表現不錯，除了有良好 的散熱系統與電源用料外，原廠還提供了Boost功能，讓效能更上一層樓，撼訊原廠提供3 年保固，後續維修與保固上有一定的保障 以上感謝賞文^^謝謝大家 --

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