好读网址:http://www.xfastest.com/thread-134439-1-1.html 前言: AMD推出R9系列後，许多厂商纷纷推出R9 270系列产品，R9 270简单说就是R9 270X降频版 ，核心部分无阉割为Pitcaim核心，拥有1280个串流处理器，功耗比R9 270X低30W为150W 这次介绍的PowerColor TurboDuo R9 270 2GB OC，在散热上下了不少功夫，采用 TurboDuo散热技术，具备两颗8公分大风扇，展现优於公版之19%散热效能提升及8%运行噪 音降低之表现 用料方面采用高规格黄金用料，其中包含多相供电设计、高品质亚铁盐芯电感和 PowerPAK SO-8封装MOSFET，可大幅提升整体超频效能及稳定性，核心时脉为930 MHz，透 过Boost可达955 MHz，并搭配2GB GDDR5记忆体与1400MHz记忆体时脉 强化散热与用料还有原厂Boost後的R9 270有怎样的表现就让我们继续看下去噜^^ http://www.xfastest.com/images/xftitle.png外包装与外观.配件 ▼外包装同样采用透明篓空设计，背面系统环境要求与产品特色：2GB GDDR5记忆体、 DirectX 11.2的支援以及最多可同时输出四个显示器的AMD Eyefinity技术、可4K*2K显示 、与采用PCIE3.0介面等，强调TurboDuo散热设计可降低8%的噪音与提升19%的散热能力， 用料部分采用高规格黄金用料 http://www.xfastest.com/data/attachment/album/201405/05/103459bgeta92an95npuxt.jpg http://www.xfastest.com/data/attachment/album/201405/05/103501i4dxvfrrlel9gslp.jpg ▼TurboDuo字样很有立体感，采用透明塑胶突字与平面文字勾出立体感 http://www.xfastest.com/data/attachment/album/201405/05/103502dyx4xawza1a5x491.jpg ▼显示卡本体与配件:安装手册、驱动光碟、DVI转接头 http://www.xfastest.com/data/attachment/album/201405/05/103503tsrrd5pgjj9idgfd.jpg ▼显示卡一览，正面导风罩采用塑胶制品，导风罩采用红黑配色，黑色为主体，红色勾出 线条，散热部分具备两颗8公分大风扇并搭配3只6mm C型热导管设计及大面积铝制鳍片， 让散热有着不错的表现，显卡本体占用2个Slot http://www.xfastest.com/data/attachment/album/201405/05/103503qyt8x8fooxyyrfxy.jpg http://www.xfastest.com/data/attachment/album/201405/05/103504q7ib41inc41cyi4w.jpg ▼输出部分有Display Port、HDMI、DVI-I，支援AMD Eyefinity，如需使用D-SUB则可以 用转头将DVI-I转成D-SUB使用 http://www.xfastest.com/data/attachment/album/201405/05/103507jmgbrot11zzl2hjr.jpg http://www.xfastest.com/images/xftitle.png细部用料 ▼背面有4颗螺丝拆开後，正反面一览，晶片四周贴有胶垫，可避免散热器压坏GPU本体 http://www.xfastest.com/data/attachment/album/201405/05/103509lmudszadv0xcl0co.jpg http://www.xfastest.com/data/attachment/album/201405/05/104732ipy64u45h61yssip.jpg ▼前半部用料一览，在DVI-I Connector上可看到金属壳做杂讯遮蔽，上方有CrossFire 金手指，电源用料采用4相供电，搭配ON-Semi NCP5395T PWM控制器与高品质亚铁盐芯电 感，MOSFET采用PowerPAK SO-8封装，结构为上1下2设计 http://www.xfastest.com/data/attachment/album/201405/05/103512bvv6vfwwfzr7wtm6.jpg http://www.xfastest.com/data/attachment/album/201405/05/103516fz7wk7kdgzgsg5rk.jpg ▼晶片周边配置一览 http://www.xfastest.com/data/attachment/album/201405/05/103513u34tvsastvk33vv7.jpg ▼後半部用料一览，需要外接6pin电源，记忆体供电采用单相供电设计 http://www.xfastest.com/data/attachment/album/201405/05/103514mdf4pdq4slp4eml4.jpg ▼晶片後方背面放满了电容，提升GPU供电稳定度 http://www.xfastest.com/data/attachment/album/201405/05/103518le1mci2t0t189c0y.jpg ▼记忆体部分采用SK Hynix H5GQ2H24AFR-R0C (运作时脉1400Mhz等效5.6G)GDDR5 8颗组 成2G容量 http://www.xfastest.com/data/attachment/album/201405/05/103519dzn7wu99u6jbwnp9.jpg ▼R9 270 核心晶片验明正身 http://www.xfastest.com/data/attachment/album/201405/05/103520crvi0a0ehz6p0l67.jpg http://www.xfastest.com/images/xftitle.png散热模组 ▼散热模组一览，散热模组分为两部分，散热鳍片与导风罩，双8公分风扇安装於导风罩 上，风扇采用PISTEK制品GA81O2U http://www.xfastest.com/data/attachment/album/201405/05/103522rvv0tb44dfvv084b.jpg ▼整体散热部分为三支6mm C型热导管，从图中可看到左右两端末端处皆为贯穿散热鳍片 式设计 http://www.xfastest.com/data/attachment/album/201405/05/103526xlqxn8jjp094j849.jpg http://www.xfastest.com/data/attachment/album/201405/05/103531sd1l9ee9y122a2l2.jpg http://www.xfastest.com/data/attachment/album/201405/05/103531wjo3j1v5zj58np1n.jpg http://www.xfastest.com/data/attachment/album/201405/05/103532aq7avqaqgyc5z7ve.jpg http://www.xfastest.com/images/xftitle.png[b][size=5]测试平台与环境 [/size][/b] 测试平台 CPU:Intel i5-4670K @ 4.5GHz Cooler: XIGMATEK GaiaII MB: ASRock B85 Pro4 RAM: A-DATA XPG DDR3-2400 16G kit(8G*2) VGA: PowerColor TurboDuo R9 270 2GB OC Storage: SanDisk U100 128G PSU: Steventeam 750W OS: Windows 7 旗舰版 64 Bit ▼3DMark06:33723 http://www.xfastest.com/data/attachment/album/201405/05/103708au81xdzcvsguttxs.jpg ▼3DMark Vantage Performance Mode:P27475 http://www.xfastest.com/data/attachment/album/201405/05/103732aa89fziohis9cbga.jpg ▼3DMark Vantage Extreme Mode:X13654 http://www.xfastest.com/data/attachment/album/201405/05/103731kn6ububznhn8hrsw.jpg ▼3DMark 11 Performance Mode:P7800 http://www.xfastest.com/data/attachment/album/201405/05/103713mzdu5mikfijfr0uj.jpg ▼3DMark 11 Extreme Mode:X2296 http://www.xfastest.com/data/attachment/album/201405/05/103709fgz3trhguvxmh25v.jpg ▼3DMark 2013 http://www.xfastest.com/data/attachment/album/201405/05/103726dod27vvoh0gffig7.jpg ▼3DMark 2013 Ice Storm Extreme:139839 http://www.xfastest.com/data/attachment/album/201405/05/103730ji88owtznu284gqu.jpg ▼3DMark 2013 Fire Strike Extreme:2573 http://www.xfastest.com/data/attachment/album/201405/05/103728m969ah4hwmmcwwnj.jpg ▼CINEBENCH R11 X64:64.39 fps http://www.xfastest.com/data/attachment/album/201405/05/103755onkef4e63j2f6obp.jpg ▼CINEBENCH R15 X64:134.63 fps http://www.xfastest.com/data/attachment/album/201405/05/103757i97gbqy6f9gbtmz2.jpg ▼BIO5 1920x1080 DirectX 10 ARGB8 TestA:147.7 fps http://www.xfastest.com/data/attachment/album/201405/05/103736h3sa47yez4safyus.jpg ▼BIO5 1920x1080 DirectX 10 ARGB8 TestB:158.9 fps http://www.xfastest.com/data/attachment/album/201405/05/103746sukxryts14xs9uuk.jpg ▼BIO6 1920x1080 DirectX 9.0C ARGB8:7428 http://www.xfastest.com/data/attachment/album/201405/05/103754a2ianhn2hodd4krd.jpg ▼DMC4 1920x1080 DirectX 10 A2RGB10 http://www.xfastest.com/data/attachment/album/201405/05/103803dvekgvbeeaaweywb.jpg ▼FF IXV 1920x1080:5242 http://www.xfastest.com/data/attachment/album/201405/05/103810bpph1uuuonuu7nnr.jpg ▼FF IXV(ONLINE)1920x1080:6423 http://www.xfastest.com/data/attachment/album/201405/05/103814fgvygiw6vmvgzcvg.jpg ▼Heaven 1920x1080 8xAA http://www.xfastest.com/data/attachment/album/201405/05/103818jvv33zzvyynp3wu3.jpg ▼LP2 1920x1080 DirectX 11 MSAA8X TestA:53.5 fps http://www.xfastest.com/data/attachment/album/201405/05/103819f5peesp5p5pyy681.jpg ▼LP2 1920x1080 DirectX 11 MSAA8X TestB:51.3 fps http://www.xfastest.com/data/attachment/album/201405/05/103820x0i5jajadfw5ccuj.jpg ▼SF IV 1920x1080 C16XQAA:11930 http://www.xfastest.com/data/attachment/album/201405/05/103822bybmmibbsmbxocqb.jpg ▼TLR 1920x1080:139.72 fps http://www.xfastest.com/data/attachment/album/201405/05/103824cvwchyyyk1hg3czm.jpg ▼FunMark烧机:最大温度69度 风扇转数45% 平均29fps http://www.xfastest.com/data/attachment/album/201405/05/103815gttt93t226d97dzr.jpg http://www.xfastest.com/images/xftitle.png[b][size=5]BF4游戏画面顺畅度测试 [/size][/b] ▼BF4显示设定 http://www.xfastest.com/data/attachment/album/201405/05/211331fnub8n858lohaiuc.jpg ▼BF4画面 http://www.xfastest.com/data/attachment/album/201405/05/211332b8a6xaxq2xz86y8p.jpg http://www.xfastest.com/data/attachment/album/201405/05/211332kdyfhs71t1nt84f2.jpg http://www.xfastest.com/data/attachment/album/201405/05/211333tlif07fzqoynsopq.jpg 游戏中顺畅度相当不错，fps都可以达到55张以上左右的表现，不会有lag的情形发生，某 些较为简单的场景可达到70张左右的水准 http://www.xfastest.com/images/xftitle.png[b][size=5] Thief游戏画面顺畅度测试 [/size][/b] ▼Thief显示设定 http://www.xfastest.com/data/attachment/album/201405/11/165301glb9rbbmxx678acz.jpg ▼Thief画面 http://www.xfastest.com/data/attachment/album/201405/11/165302zag264kx6rg6x26x.jpg http://www.xfastest.com/data/attachment/album/201405/11/165303iy6wctox0b64ct2y.jpg http://www.xfastest.com/data/attachment/album/201405/11/165304kbwfnfuzb8p622ug.jpg 游戏中顺畅度相当不错，fps都可以一直维持在60张左右的表现，这款是目前2014年的游 戏，画面来说细节还不差，跑起来真的很顺畅，没有半点延迟现象产生 http://www.xfastest.com/images/xftitle.png[b][size=5]总结[/size][/b] 这张撼讯PowerColor TurboDuo R9 270 2GB OC在用料上下了不少工夫，电源方面采用高 规格黄金用料，包含多相供电设计、高品质亚铁盐芯电感和PowerPAK SO-8封装MOSFET， 可大幅提升整体超频效能及稳定性 散热方面采用两颗8公分风扇并搭配大面积铝制鳍片有效率地降低温度，展现优於版之19% 散热效能提升及8%运行噪音降低之表现，使用FurMark烧机最高温仅69度 且风扇声音相当 安静，几乎感觉不出来显示卡在全速运转!! 在测试过程中表现很不错，效能达到一定的水准，且原厂预设含Boost功能，效能比公版 卡表现更佳，许多游戏都可以维持不错的效能水准，已可满足一般消费者在大部分游戏的 顺畅度，在BF4与Thief实际测试流畅度中，表现还不错，玩起来非常顺畅，场景与画面细 节表现也相当不错，这部分可以给需要的玩家做参考 http://www.xfastest.com/data/attachment/album/201405/11/161107gdi04gv4xw090zx4.jpg 在价格方面PowerColor TurboDuo R9 270 2GB OC这张在系列的价格较为漂亮的一款产品 ，与其他厂牌价格相差有500~1000元左右的差价，且为短卡设计，非常适合安装在HTPC主 机内，原厂出厂提供Boost功能，让效能表现更加出色，缩短了与R9 270X的效能差距，当 然有兴趣的玩家可以透过第三方软体来做超频，相信会有更佳的表现，但别忘了散热方面 还是要注意；有这样的效能与漂亮的价格大大提升了这款PowerColor TurboDuo R9 270 2GB OC的CP值 整体来说中阶卡定位的撼讯PowerColor TurboDuo R9 270 2GB OC表现不错，除了有良好 的散热系统与电源用料外，原厂还提供了Boost功能，让效能更上一层楼，撼讯原厂提供3 年保固，後续维修与保固上有一定的保障 以上感谢赏文^^谢谢大家 --

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