清華大學動力機械工程學系 短期課程 (本課程完全免費並提供上課講義) 課程名稱：Introduction to MEMS and NEMS 授課老師：林立偉 教授 Prof. Liwei Lin 清華大學動機系 講座教授（客座） Chancellor’s Professor Department of Mechanical Engineering Co-Director, Berkeley Sensor and Actuator Center University of California at Berkeley, USA 地點：清華大學工程一館 108室 時間：2009年9月8日 - 9月9日 課程資訊：http://www.pme.nthu.edu.tw/extra/class_info.php 報名：http://www.pme.nthu.edu.tw/extra/class_register.php 課程內容： September 8, 2009 (Tuesday) 09:00 - 10:30 am Introduction to MEMS 10:30 - 11:00 am Break 11:00 - 12:30 pm Surface-Micromachining 12:30 - 01:30 pm Lunch 01:30 - 03:00 pm Bulk-Micromachining and Other Processes 03:00 - 03:30 pm Break 03:30 - 05:00 pm MEMS Packaging and Approaches September 9, 2009 (Wednesday) 09:00 - 10:30 am Introduction to NEMS 10:30 - 11:00 am Break 11:00 - 12:30 pm 1-D Nanostructures – Carbon Nanotubes and Nanowires 12:30 - 01:30 pm Lunch 01:30 - 03:00 pm 0-D Nanostructures – Quantum Dots 03:00 - 03:30 pm Break 03:30 - 05:00 pm Open Discussions Who Should Attend? This short course targets students/researchers with no or minimum knowledge in the areas of MEMS (Microelectromechanical Systems) and NEMS (Nanoelectromechanical Systems). Attendees with basic understandings in physics, chemistry and engineering mechanics, although not necessary, will be helpful in understanding the course materials. Course Description: The course aims to provide basic knowledge of microelectromechanical systems and nanoelectromechanical systems including design, fabrication of micro and nanostructures’ various micro- and nano-machining processes; fabrication principles of integrated circuit device and their applications for making MEMS/NEMS devices; and device/system examples. During the first day of the short course, an overview of MEMS manufacturing technologies and related device manufacturing issues will be introduced at the beginning. Specific MEMS fabrication processes such as surface- and bulk-micromachining processes for key MEMS commercial products will then be addressed. Packaging related topics such as hermetical sealing processes, accelerated testing and vacuum encapsulation skills will be discussed, along with advanced approaches for MEMS packaging and assembly, integration issues and future directions. During the second day of the short course, nanofabrication technology will be discussed, including how one achieves the nanometer length scale, including "bottom up" and "top down" technologies; examples of nanoscience phenomena (the crossover from bulk to quantum mechanical properties); and applications (from integrated circuits, quantum computing, MEMS, and bioengineering). An open discussion at the end will conclude the two-day short course. 歡迎自行轉載 ------------------------------------------------------------------------------ 充電會版位址如下： PTT→分組討論區→生活娛樂館→Life_Plan 人生→Refresh【充電板】─終身學習 ------------------------------------------------------------------------------ --

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