TSMC reference flow 7.0 +Statistical Timing Analysis Design for Manufacturing (DFM) Reference Flow 7.0 includes key DFM features that designers can exercise throughout the design cycle. For example, critical area analysis (CAA) proactively identifies potential random manufacturing defects and drives wire spreading and wire widening corrective actions. Virtual chemical mechanical polishing (VCMP) analysis identifies metal and dielectric thickness variation hot spot, and guides dummy metal insertion to improve thickness uniformity throughout the chip. In addition, selected lithography process check (LPC) post-production tools have been qualified by TSMC as DFM compliant. New Implementation Track Reference Flow 7.0 includes a third implementation track partner, Magma Design Automation. Similar to the implementation tracks featuring tool sets predominantly from Cadence and Synopsys, the new Magma track delineates a complete methodology using mostly Magma’s tools. The flow has been validated by TSMC and is available immediately. http://www.tsmc.com/chinese/c_services/c01_design/c0105_reference.htm http://tinyurl.com/jchv4 --

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