作者cepy (pyche)
看板Tech_Job
标题[请益] 台积Process Development Engineer请益
时间Tue May 2 23:03:00 2023
[代强者我同学po]
各位前辈好,
小弟为四大理工硕一,实验室做模拟计算的。
前两天收到台积实习面试邀请,细节如下:
--------------------------------------
A. 职务名称: Process Development Engineer 2023 Intern
工作地点: 中科Taichung Site, 龙潭Longtan
B. 职务说明:
1) Develop expertise in advanced TCB bonding related process development
2) Drive development of new technology for semiconductor advanced packaging
bonding applications
3) Fundamental studies to validate the mechanism of defects that encountered
4) Work closely and collaborate with equipment suppliers, towards roadmap and
schedule alignment
5) Collaborate with equipment engineers to provide and receive feedback on
equipment/process interactions
C.职务需求:
1) Major in Mechanical Engineering, Materials Science and Engineering and
Chemical Engineering related fields.
2) Hands-on participation and a strong sense of ownership are required.
3) Strong technical problem-solving and analytical skills, based upon
fundamental and empirical models
4) Excellent teamwork capabilities, able to receive and provide inputs for
cross-functional projects
5) Have basic mechanical-related knowledge. Having the semiconductor
processes knowledge is a plus.
6) Basic written and spoken communication skills are required.
7) Being able to communicate in Mandarin and English
8) Strong Project management and priority handling skills with self-motivation
9) Have ability to edit code is a plus, such as Python, C#, C++, Matlab
------------------------------
根据关键字,看来是做先进封装的,似乎很有前途(?),
但好像还是产线缺,484 GG骗人的新手法?
再麻烦知道单位内部工作内容、风气的前辈多给些资讯,感谢!
--
※ 发信站: 批踢踢实业坊(ptt.cc), 来自: 140.112.229.158 (台湾)
※ 文章网址: https://webptt.com/cn.aspx?n=bbs/Tech_Job/M.1683039782.A.B3A.html
※ 编辑: cepy (140.112.229.158 台湾), 05/02/2023 23:04:14
1F:推 tony890415 : 封装不是IIP都是产线ㄅ 05/02 23:10
2F:推 gn01216674 : 是有啥前途? 05/02 23:13
3F:推 gn01216674 : 你八成化工或化材吧 就去实习阿 不然能去哪 05/02 23:19
4F:推 electronicyi: 112在那边四大 05/02 23:32
5F:→ yuchungyi : 都明白写process了哪来的新手法 05/02 23:41
6F:推 Bansar : 实验室可以放人 就去啊 05/02 23:46
7F:→ aria0520 : 学弟 112跟人喊啥四大 05/02 23:57
8F:→ aria0520 : 四大都成大在喊的 05/02 23:57
9F:→ csb80527 : 骂不然,你才不然,这素质不意外 05/03 00:38
10F:推 kyle5241 : 我们CEO就是因为做这个才被张爷爷拉上去的喔。当初 05/03 05:39
11F:→ kyle5241 : 梁孟松不想做以为被流放就离开了 05/03 05:39
12F:推 kyle5241 : 这明显研发缺啊.. 研发比产线累啦 但新领域你应该 05/03 05:42
13F:→ kyle5241 : 可以玩的很开心 05/03 05:42
14F:→ sc1 : Thermo-Compression Bonding (TCB)机会很好请把握 05/03 12:29
谢谢各位大大,忘了说是代po,所以才写四大~
※ 编辑: cepy (140.112.229.158 台湾), 05/03/2023 21:27:13
15F:推 stosto : 要会写程式干嘛? 05/05 17:37