作者gothmog (上海极司非尔路76号)
看板Tech_Job
标题TSMC’s leading 3DIC Technologies
时间Fri Oct 4 21:42:18 2019
As heterogeneous integration of chiplets becomes increasingly important in ext
ending system scaling, we’ve recently compiled 3 major technology offerings f
rom #TSMC for chiplet integration into what we call Wafer Level System Integra
tion Platform.
Check out the chronological account of these technology evolution as well as t
he latest addition to the platform:
https://lnkd.in/etE4BkQ
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※ 发信站: 批踢踢实业坊(ptt.cc), 来自: 114.136.129.83 (台湾)
※ 文章网址: https://webptt.com/cn.aspx?n=bbs/Tech_Job/M.1570196542.A.D19.html
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