请问有版友在美国当半导体制程整合工程师吗? 因为第一个电话面试, 对方主管说从我的RESUME看不到我以前作了甚麽 想请有相关经验的版友给我一些建议 我本身在台湾有五年工作经验 跟面试的公司是正相关 我履历上两个工作经验, 都各自写上两句话 写出重要的成就(成功开发了甚麽产品, 跟提升多少良率) 跟主要负责的工作内容的科技 (eg 0.18um制程跟产品类型) 下面再列出细项, 列出主要会的工作技能 例如: CP分析, 良率提升.....etc 履历是只有写一页, 就重点条列 自己以为这样写得很清楚 但今天电话面试完, 开始怀疑履历是不是写太差了 >///< 有点不确定的地方是 我是否需要把我开发产品过程中, 所遇到的问题, 如何解决都一一写出来吗?? 到底需要详细到甚麽程度呢? 我本以为是写出达成目标 然後面试中再跟对方口头解释怎麽达到目标即可, 但这样会太简略吗?? 没想到第一个面试就是我的dream job, 连练习interview的机会都没有就赶鸭子上架 真的很希望能好好把握这个机会 谢谢大家, 有任何建议欢迎各位指导 感激不尽 & 新年快乐 这边也贴上我的履历给大家参考, 看我应该如何改进会比较好, 谢谢 Highly analytical and work efficient engineer with 5 years of process integration and development experience in semiconductor industry. Work experience XXXXXXXXXXXXXXXXXXXX, Hsinchu, Taiwan Oct., 2010~ Dec., 2011 Senior Foundry Engineer/ R&D Center/ Pixel Design Department - Successfully improve yield from 30~50% to 80% by ion implantation split experiment. - Performed R&D and successfully produced 0.13um, 0.11um, 90nm process, 8 inch wafer CIS product. - Main responsibilities include new product/ technology development and transfer to mass production. ‧ CP analysis ‧ Yield improvement (RD to Production stage) ‧ Process integration ‧ Liaison between designer and foundry fab ‧ Design experiment to improve product performance ‧ New FAB product and process development XXXXXXXXXXXXXXXXXXXXXX, Hsinchu, Taiwan Dec., 2006~ Apr.,2010 Senior Process Integration Engineer/Special Technology Division/ CMOS Image Sensor Department - Ramp up CIS product from development stage to mass production, produced yield improvement from 0~20% to 70%. - Main responsibilities include new product development and assist mass production. - Responsible for development of Backside illumination (BSI) CIS (new product). ‧ Patent research ‧ Process flow set-up/experiment design ‧ New process vendor and apparatus survey ‧ Trouble shooting/problem analysis Job Skills ‧ CP analysis/ Yield enhancement ‧ FEOL/ BEOL/ CFA process improvement ‧ Troubleshooting/ data & root cause analysis ‧ Communicate with cross function engineers ‧ Product management ‧ Semiconductor process integration ‧ Knowledge of TCAD simulation ‧ Knowledge of characterization/ package/ Final Test Education XXXXXXXXXXXXXXXXX, Taipei, Taiwan Aug., 2004~ July, 2006 Master degree/ Materials Science and Engineering/ Optoelectronic Thin-Film Processing Lab - Successfully deposited an Al2O3 inorganic layer by atomic layer deposition (ALD) on polyimide (PI) substrates to achieve the requirement of OLED’s, 10-3 c.c./m2．day of OTR. - Developed a simple, yet sensitive, permeation measurement method based on helium permeation to evaluate the thin film barrier properties. (Patent applied) XXXXXXXXXXXXXXXXX, Taipei, Taiwan Aug.,2000~ July, 2002 BS degree/ Chemical Engineering Language ‧ Chinese/ Mandarin Write/Read/ Speak/ Listen Native language ‧ English Write/Read/ Speak/ Listen Fluent --

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