Dear all, 我们共有 25 篇 paper 要 review, 下面是分配的篇数。 博五 陈泰蓁 x2 博一 陈皇宇 x1 硕二 陈彦宾 x1 博三 方宇纶 x2 博一 方家伟 x1 硕一 林忠纬 x1 博三 喻秉鸿 x2 博一 林依洁 x1 硕一 周思睿 x1 博二 陈东杰 x2 博一 林柏宏 x1 硕一 许钦雄 x1 博二 江哲维 x1 硕二 蒋梅芳 x1 硕一 陈信成 x1 博二 李婉萍 x1 硕二 林翠薏 x1 硕一 刘宏毅 x1 博二 廖光万 x1 硕二 许天彰 x1 硕一 李奇峰 x1 下面是 paper 的详细资料， 选择的规则同之前，年级愈低优先权愈高。 若之前老板有先用 email assign 给一些人 review，请加注 "assigned" (我没这些资料)，这些被 assigned 的 paper 就由所指定的人 review。 paper 会由 email 寄给各位。 GLSVLSI 115 Block Alignment in 3D Floorplan Using Layered TCG GLSVLSI 123 Fast Floorplanning for FPGAs with Heterogenous Resources GLSVLSI 126 The O-Sequence: Representation of 3D-Floorplan Dissected by Rectangular Walls GLSVLSI 128 Does Partitioning Matter for 3D Floorplanning? GLSVLSI 140 GRP: A Top-down Placement Algorithm for Reducing the Global Interconnect Count GLSVLSI 141 Low-Power Clustering with Minimum Logic Replication for Coarse-grained, Antifuse based FPGAs GLSVLSI 169 DTS: A Tree Based Representation for 3D-Block Packing DAC 11 Etch and Photolithography Process Interaction Effects Implication for Device Layout Design DAC 65 Fast Wire Length Estimation by Net Bundling for Block Placement DAC 78 A Stable Metric for VLSI Interconnect DAC 128 Lithographic Computation - the Present and the Future DAC 241 Automated Regression Test Selection for Optical Proximity Correction DAC 272 A H.264 HDTV Decoder Chip with Novel Physical Design Methods DAC 299 A Novel General Graph-Based Simplex Algorithm Applied to IC Layout Compaction and Migration DAC 305 Voltage Islands Generation in Chip Level Floorplanning Considering Performance Constraints DAC 331 Litho-friendly Layout for a 45nm Node Static CMOS Reduced Standard Cell FinFET Library DAC 462 Analysis of SOI circuit performance variability by Non-Equilibrium Initial Condition Analysis, NEICA DAC 515 Fast and Accurate Litho-Hotspot Dectection Using Range Pattern Matching DAC 516 Faster, Parametric Trajectorybased Macromodels Via Localized Linear Reductions DAC 636 Standard Cell Characterization Considering Lithography Induced Variations DAC 734 Incremental Placement for Structured ASICs using the Transportation Problem DAC 838 Hippocrates: First-Do-No-Harm Detailed Placement DAC 879 An Automated Core Power Network Closure Methodology DAC 985 A New LP Based Incremental Timing Driven Placement for High Performance Designs TCAD 2910 Reticle Floorplanning and Wafer Dicing for Multiple Project Wafers: A Volume-Driven Compatibility Optimization Approach --

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