TSV-based 3D IC Research Activities at the Georgia Tech Computer-AidedDesign (GTCAD) Laboratory Abstract This talk provides an overview of various 3D IC research projects being conducted at the Georgia Tech Computer-Aided Design (GTCAD) laboratory in two parts. First, we present our 3D-MAPS (massively parallel processor with stacked memory) processor, arguably the first many-core 3D processor from academia. This 3D IC is taped out in March 2010 and will be fabricated by August 2010. We discuss the architecture, TSV-based chip-to-chip communication methodology, 3D computer-aided design (CAD) tool-flow, packaging, and testing mechanism. Second, we present various ongoing research projects that encompass design-for-manufacturability (DFM), design-for-testing (DFT), advanced cooling with microfluidic channels, TSV management during circuit and physical design, and heterogeneous integration issues for TSV-based 3D ICs. Our sponsors include the National Science Foundation (NSF), Semiconductor Research Corporation (SRC) , US Department of Defense (DOD), Intel, and IBM. About Sung Kyu Lim Sung Kyu Lim received the B.S., M.S., and Ph.D. degrees from the Computer Science Department, University of California, Los Angeles (UCLA), in 1994, 1997 , and 2000,respectively. He joined the School of Electrical and Computer Engineering, Georgia Institute of Technology in 2001, where he is currently an Associate Professor. His research focus is on the modeling, circuit design, and computer aided design for through-silicon-via-based 3D integrated circuits. Dr. Lim received the National Science Foundation Faculty Early Career Development (CAREER) Award in 2006. He served as an Associate Editor of the IEEE Transactions on Very Large Scale Integration Systems during 2007-9. He is the author of "Practical Problems in VLSI Physical Design Automation" (Springer, 2008). Time: 3:30pm-6:00pm, June 11, 2010 (Friday) Place: Room ED528, Dept. of Electronics National Chiao Tung University Home page: http://users.ece.gatech.edu/~limsk --

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